Plenary Lecture
Parametric Design for Adhesive Dispensing Process in Electronics Manufacturing
Professor Jay (Chien-Yi) Huang
Department of Industrial Engineering and Management
National Taipei University of Technology
Taiwan ROC
E-mail: jayhuang@ntut.edu.tw
Abstract: Due to increasing environmental consciousness, the European Union has prohibited the use of lead substances in electronics soldering material. 58Bi/42Sn solder with a melting temperature of only 138°C helps achieve a lower process temperature to resolve the board warpage issue. Curing the adhesive simultaneously with solder reflow helps simplify the assembly process and reduces the manufacturing cost. When a low soldering temperature profile is used, the impact on the adhesion performance of the cured adhesive becomes a major concern. This study develops an environmentally conscious adhesive dispensing process. The case study considers a stereo product using the low cost CEM-1 PCB material and select 58Bi/42Sn as solder alloy. Taguchi based experimental design is employed to investigate the influence of process parameters on the shear strength of 0805 chip capacitors under various test conditions. In additional to PCA methodologies, this study also employs TOPSIS method to determine the optimal process scenarios for the multiple quality characteristics.
Brief Biography of the Speaker: Chien-Yi Huang received the Ph.D. degree from the State University of New York at Binghamton, Vestal in 1996. He is currently an Associate Professor with the National Taipei University of Technology, Taipei, Taiwan. He was the Head - Chief of Process Technology with Wistron Corporation, and was involved in research on new process technology enabling and materials characterization. His current research interests include process optimization of electronics manufacturing and electronics reliability. He has 20 publications in highly rated ISI journals and 35 in conference proceedings.