Other Articles by Authors

Arivarasi A.
Anand Kumar

Authors and WSEAS

Arivarasi A.
Anand Kumar

WSEAS Transactions on Environment and Development

Print ISSN: 1790-5079
E-ISSN: 2224-3496

Volume 13, 2017

Notice: As of 2014 and for the forthcoming years, the publication frequency/periodicity of WSEAS Journals is adapted to the 'continuously updated' model. What this means is that instead of being separated into issues, new papers will be added on a continuous basis, allowing a more regular flow and shorter publication times. The papers will appear in reverse order, therefore the most recent one will be on top.

Volume 13, 2017

Layering of Copper-ink Using 3D Printing & Characterization

AUTHORS: Arivarasi A., Anand Kumar

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ABSTRACT: The use of nano materials, particularly copper is of interest, in areas like printed electronics and chemical engineering. Copper is highly conductive in nature and thin films on a substrate makes the structure more significant. Printing copper requires melting of macro size particles conventionally, whereas the viscous mixture of nano ink composition, utilizing spray mechanism in 3D printing for precision. The copper particles of around 100 nm sizes is used for experimentation and a coating is made with a thickness ranging 6.41 µm to 8.41 µm without usage of laser mechanisms, which is shown through SEM images. The grain size distribution is uniform and porosity is 0.56% measured through optical microscope. Resistivity measured is 7µ ohm cm / 7e-8 ohm m. The structure will be further utilized for an electrochemical sensing mechanism based on water quality measurement procedure. The advantages are lower processing temperature and usage of vacuum and controlled environment is avoided. This is cost-effective to avoid bigger 3D printing machineries.

KEYWORDS: layering, copper, 3D-Printing, sintering, electro less printing, conductive


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WSEAS Transactions on Environment and Development, ISSN / E-ISSN: 1790-5079 / 2224-3496, Volume 13, 2017, Art. #41, pp. 394-400

Copyright © 2017 Author(s) retain the copyright of this article. This article is published under the terms of the Creative Commons Attribution License 4.0

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