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Anna Stoynova
Borislav Bonev

Author(s) and WSEAS

Anna Stoynova
Borislav Bonev

WSEAS Transactions on Electronics

Print ISSN: 1109-9445
E-ISSN: 2415-1513

Volume 8, 2017

Notice: As of 2014 and for the forthcoming years, the publication frequency/periodicity of WSEAS Journals is adapted to the 'continuously updated' model. What this means is that instead of being separated into issues, new papers will be added on a continuous basis, allowing a more regular flow and shorter publication times. The papers will appear in reverse order, therefore the most recent one will be on top.

Practical Consideration for Lock-in Thermography Effective Spatial Resolution

AUTHORS: Anna Stoynova, Borislav Bonev

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ABSTRACT: The aim is to study some factors influence on the contrast decreasing of the ampligram and phasegram obtained after lock-in thermography. It is analysed the effect of delay between excitation source modulated parameter changing and modulated signal. Two software corrections for decreasing the effect of these factors are developed. The offered corrections can be used with different types of excitation sources. In order to evaluate the effect of these corrections, lock-in thermography measurement is performed. Multiple results processing at different correction parameters’ values are studied for PCB samples. The contrast dependence from correction parameters in graphical form is presented. Multiple results processing with random correction parameters values using the both corrections are performed for determination of maximum possible contrast An iterative method with less number of results processing for choosing appropriate values of correction parameters using the both corrections is proposed. The effect of this method is presented and compared in tabular and graphic form. The investigated sample is PCB (evaluation of copper layers’ adhesion on FR-4).

KEYWORDS: lock-in thermography, excitation source, contrast increasing, digital lock-in correlation, Fourier transformation


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[4] H. Zhao, Z. Zhou, J. Fan, G. Li и G. Sun, Application of lock-in thermography for the inspection of disbonds in titanium alloy honeycomb sandwich structure, Infrared Physics & Technology, 2016

[5] S. Delanthabettu, M. Menaka, B. Venkatraman, B. Raj, Defect depth quantification using lockin thermography, Quantitative InfraRed Thermography Journal, 12, 1, 2015, pp. 37-52.

WSEAS Transactions on Electronics, ISSN / E-ISSN: 1109-9445 / 2415-1513, Volume 8, 2017, Art. #9, pp. 66-72

Copyright © 2017 Author(s) retain the copyright of this article. This article is published under the terms of the Creative Commons Attribution License 4.0

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