Plenary Lecture

Recovery of Metals from Electronic Industry Wastes

Professor Hong Hocheng
co-author: Professor U. U. Jadhav
Department of Power Mechanical Engineering
National Tsing Hua University
Taiwan ROC

Abstract: The rapid progress of electronic packaging technology is resulting in huge amount of electronic waste (E-Waste) particularly in the form of solders and printed circuit boards (PCBs). Such E-waste contains heavy metals. The recycling of such E-waste for recovery of the metals decreases the environmental impact by reducing the amount of waste and the need of mining the metals. Hence the E-waste can act as an important secondary source for heavy metals. Several promising hydrometallurgical and bio-hydrometallurgical processes were developed to recover the precious metals from E-waste. Environmental friendliness and cost effectiveness are among the merits of some processes. The effects of various process parameters on metal leaching were investigated. Use of large pieces of PCBs facilitated reusability of PCBs and avoided difficulties in metal purification.

Brief Biography of the Speaker: Professor Hong Hocheng earned his PhD from UC Berkeley in US and is now the Tsing Hua Chair Professor at National Tsing Hua University in Hsinchu, Taiwan. . He has published more than 150 journal papers and 40 patents in the area of manufacturing technology. His research interest lies in the new manufacturing processes. Recently he has made innovative research in achieving effective monitoring for nanoimprint and reclaim of heavy metals from industrial wastes by microbes. He has been cited Outstanding Teaching by NTHU for teaching the undergraduate required courses of Manufacturing Processes and Technology. Prof. Hocheng served as the editorial board member of more than 15 international journals. He received National Academic Prize from Ministry of Education and Outstanding Research Awards from National Science Council of Taiwan. Prof. Hocheng is internationally recognized by Prof. Fryderyk Staub Golden Owl Award from World Academy of Manufacturing and Materials Engineering.

Bulletin Board


The Conference Program is online.

The Conference Guide is online.

The paper submission deadline has expired. Please choose a future conference to submit your paper.

Plenary Speakers

WSEAS Main Site

Publication Ethics and Malpractice Statement